Thermal Greases - elNanoŽ 100
elNanoŽ 100 thermal grease compound is specifically designed for thick-film heat management applications in the IT and electronics industry (100µm - 250µm bond line thickness).
elNanoŽ 100 thermal grease compound can be used on CPU's, GPU's and other high power modules which require superior heat transfer & heat management.
The silicon-free carrier material has been developed especially for the purpose of thermal transmittance and is mixed with Carbon Nano Fibres (CNF's) which function as thermal conductors. This nanocomposite enables the consistent transfer of heat - from the source of heat (i.e. CPU/GPU) to the cooling system (i.e. heatsink/fan).
elNanoŽ 100 thermal grease compound can be applied universally and does not react with other media due to the advanced CNF/carrier compound.
Advantages of elNanoŽ 100:
§ Low specific density enables filling of comparable volumes with significantly less
weight than with conventional greases
§ Nanoscale filler material enables application of extremely thin layers, providing
better conductivity
§ Contrary to other silicon-free thermal greases, elNanoŽ 100 provides full
performance after initial application
§ elNanoŽ 100's viscosity enables easy application in screen printing procedures;
viscosity can be adjusted as desired
§ elNanoŽ 100's attributes prevents bleeding, drifting, evaporating, or yielding; yet
it can be easily removed
Properties
Color: Black
Specific Gravity: 1.4 g/cm3
Thermal Conductivity: 5,9 W/mK
Stability Range: -40 to +180°C
Example of use
The main application area for elNanoŽ 100 is thick-film
applications in the IT industry. elNanoŽ 100 provides uniform
heat dissipation from CPU's, GPU's and other hotspots to the
cooling unit.
Download our Product Guide for elNanoŽ 100
product details and specifications.
Download >>
§ Product Guide (3,032KB)
§ MSDS (3,032KB)
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Marion Nanosystems
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Applications
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§ Thick-film applications
§ 100µm - 250µm bond
line thickness
§ IT
§ Electronics
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